Influence of Titanium Oxide on Structure, Corrosion and Soldering Properties of Sn82Bi15Zn3 Alloy_ Crimson Publishers

 Influence of Titanium Oxide on Structure, Corrosion and Soldering Properties of Sn82Bi15Zn3 Alloy by Abu Bakr El-Bediwi* in Research & Development in Material Science_ Materials Science and Technology

 

Abstract
Our work study the effect of titanium oxide on structure, soldering properties such as melting temperature, wetting process and corrosion behavior of Sn₈₂Bi₁₅Zn₃ alloy. Microstructure of Sn₈₂Bi₁₅Zn₃ alloy changed after adding different ratio from titanium oxide. Lattice microstrain of Sn₈₂Bi₁₅Zn₃ alloy varied (increased) after adding titanium oxide. Melting temperature of Sn₈₂Bi₁₅Zn₃ alloy varied after adding Ti₂O. Sn81.4Bi₁₅Zn₃(Ti₂O)0.6 alloy has low melting temperature. The contact angle Sn₈₂Bi₁₅Zn₃ alloy decreased after adding different ratio from titanium oxide. Corrosion resistance of Sn₈₂Bi₁₅Zn₃ alloy varied (increased) after adding Ti₂O. From our results, soldering properties (melting temperature and contact angle) and corrosion resistance of Sn82Bi15Zn3 alloy improved after adding Ti₂O.

Introduction
Soldering is a low temperature metallurgical joining process. In electronics applications low temperature and reversibility are especially important because of the materials involved and the necessity for reworking and making engineering changes. Solder joining is a wetting process followed by a chemical reaction. Wettability is a function of the materials to be joined, with Cu, Ni, Au, and Pd, as well as alloys rich in one or more of these metals, being particularly amenable to soldering. The chemical reaction following wetting is between the molten solder and the joining metallurgy to form an intermetallic phase region at the interface. Microstructure, wettability and physical properties of Sn96-xZn4Bix alloys are reported by El-Bediwi et al. [1]. The melting temperature of Sn96Zn4 alloy decreased after adding bismuth. But contact angle of Sn96Zn4 alloy varied after adding bismuth. Adding silver caused a significant increase in bismuth-tin-zinc alloy strengthens with a little decreased in melting temperature [2]. El-Bediwi et al. [2] reported that, there is a significant decrease in melting temperature of bismuth-tin-zinc alloy with a very little increase in strengthens after adding indium. Microstructure, thermal parameters, wettability and electrochemical corrosion process of Bi30Sn50Sb10A15Zn3Cu2, Bi25Sn61Sb5Zn4Al3Ag2, and Bi20Sn60Sb7A15Zn3Cd3Cu2, alloys have been studied [3]. Microstructure, wettability behavior, corrosion parameters, thermal properties of quaternary bismuth- tin based alloy have been investigated using different experimental techniques and the results show that, some properties of Bi60Sn40 alloy improved after adding Sb-Zn or Sb-Ag elements [4]. Tin- zinc eutectic alloy has been considered as a candidate for lead free solder materials because of its low melting point, excellent mechanical properties and low cost [5-7]. Mostly solders are based on Sn-containing binary and ternary alloys. Several elements have been selected as alloying elements such as Zn, Bi, Cu, Ag, Sb and so on [8-10]. Specific researchers [11-15] reported that, tin- zinc eutectic solder alloy is poor wettability, reliability, strength, easy oxidation and microvoid formation. To avoid these disadvantages or improve the properties of it, they added minor amount of Bi, Cu, In, Ag, Al, Ga, Sb, Cr, Ni, Ge elements to develop ternary and even quaternary Pb free alloys. The aim of our work was to study the effect of titanium dioxide on microstructure, soldering properties and corrosion of tin bismuthzinc alloy

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